XPENG EV Platforms

This article summarizes XPENG major EV platforms and why they matter. A platform is not just a chassis. It is a layered system that shapes real-world behavior: charging curve stability, sustained performance, thermal limits, software longevity, and autonomy headroom.

What an XPENG platform controls

XPENG platforms can be understood as three tightly coupled layers. Together, these layers explain why the vehicle behaves the way it does beyond headline specs.

• Vehicle platform (hardpoints + packaging): crash structure, battery placement, suspension hard points, underbody integration strategy
• High-voltage powertrain layer: 800 V-class SiC (silicon carbide) power stage, fast-charge capability, inverter/drive-unit integration
• Electrical/electronic architecture (EEA): centralized compute + domain controllers, OTA scope and speed, sensor/ADAS integration

XPENG platform roadmap

XPENG platform evolution is commonly described in three bands:

• Legacy / current: Edward platform generation (vehicle platform lineage), paired with X-EEA 3.0 for newer centralized EEA
• Current / next: SEPA 2.0 (Smart Electric Platform Architecture) as the modular EV platform direction
• Forward: deeper SDV alignment (software-defined vehicle) through more centralized EEA and higher platform modularization

XPENG platform lineup

Platform / Architecture	Primary Use	Voltage / Charging	Architecture Direction	Representative Examples
SEPA 2.0	Modular EV platform family (multi-body support)	Often paired with “full-domain” 800 V-class fast charging (model dependent)	Toolbox-style modular platform intended to reduce cost and speed model development	G6 (first SEPA 2.0 launch model), P7+ (public reviews cite SEPA 2.0)
Edward platform	Earlier XPENG vehicle platform generation	Varies by vehicle generation	Legacy platform lineage used as a base for prior programs	Earlier P7 and G9 generations (lineage dependent)
X-EEA 3.0	Centralized electrical/electronic architecture (EEA)	Enables higher OTA speed and broader ECU (electronic control unit) consolidation	Central supercomputing + local control modules; domain controller synchronization for faster OTA	G9 architecture messaging highlights X-EEA 3.0
800 V SiC power stage	High-voltage fast-charging and efficiency layer	800 V-class; DC peak varies by model and pack	Supports high power charging and efficiency via SiC inverters; typically paired with advanced thermal control	G6 and X9 product pages emphasize 800 V SiC

SEPA 2.0 (Smart Electric Platform Architecture)

SEPA 2.0 is XPENG modular EV platform direction intended to scale across multiple body styles and wheelbases while reducing development time and cost. In practice, SEPA 2.0 is the vehicle platform layer that sets packaging, hardpoints, and structural strategy, and it is commonly paired with an 800 V-class powertrain stack on newer models.

What SEPA 2.0 tends to enable:

• Broader body-type coverage from a shared toolbox platform (reduces unique engineering per model)
• Faster platform-to-model iteration for refresh cycles
• Higher integration potential (modular assemblies and underbody integration)

See the SEPA 2.0 platform.

Edward platform (legacy vehicle platform lineage)

Edward is commonly referenced as an earlier XPENG vehicle platform generation. It matters mainly as a reference point: it helps explain which models predate the SEPA 2.0 direction and why some architectural traits differ across XPENG lineup.

How to use this on model pages:

• Use Edward as a platform generation label (legacy) rather than a feature signal
• Use SEPA 2.0 as the modern platform direction label where applicable

See the Edward platform.

X-EEA 3.0 (centralized EEA)

X-EEA 3.0 is XPENG centralized electrical/electronic architecture direction. EEA is the layer that determines OTA scope, update speed, controller consolidation, and how ADAS compute and sensors integrate at the vehicle level.

What a centralized EEA tends to improve:

• Broader OTA reach across domains (not just infotainment)
• Faster multi-domain updates via synchronized domain controllers
• Clearer path to higher compute centralization (SDV direction)

See the X-EEA 3.0 architecture.

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