XPENG EV Platforms

SEPA 2.0 · 800 V · X-EEA 3.0 · Turing

XPENG sells its architecture as well as its cars. Volkswagen's China models will ride on E/E hardware XPENG co-developed.

Bar chart of driving compute: two NVIDIA Orin X chips give 508 TOPS on the G6 and G9 Max, against 2,250 TOPS from three XPENG Turing chips on the G7 Ultra. Below, the XPENG platform stack from top to bottom: the in-house Turing AI chip running a VLA driving model; X-EEA 3.0 with a central computer and zonal controllers; full-domain 800 V silicon carbide with 5C charging; and the SEPA 2.0 (Fuyao) modular body with cell-integrated body construction. DRIVING COMPUTE, TOPS 2x NVIDIA Orin X 508 TOPS (G6, G9 Max) 3x XPENG Turing 2,250 TOPS (G7 Ultra) THE XPENG PLATFORM STACK Turing AI chipin-house; VLA driving model X-EEA 3.0central computer, zonal controllers 800 V SiCfull-domain high voltage, 5C charging SEPA 2.0 (Fuyao)modular body, cell-integrated body
Platform
SEPA 2.0
Voltage
800 V SiC
Own chip
Turing
Hub
Systems

Finding

XPENG has moved its platform from bought-in silicon to its own driving chip in two years, and licenses the result to Volkswagen

SEPA 2.0, also called Fuyao, launched on the G6 in 2023 with cell-integrated body construction, front and rear castings and full-domain 800 V silicon carbide power electronics; XPENG says it reuses most components across models and shortens development time. X-EEA 3.0, first on the G9, splits the car into a central supercomputer and zonal controllers, which lets XPENG push updates to driving, chassis and cabin together. In 2025 the G7 Ultra replaced NVIDIA Orin X with three in-house Turing chips.

The models on SEPA 2.0 cover sedans, SUVs and an MPV: G6, G7, the second-generation P7, P7+, X9 and the low-cost MONA M03. All use 800 V; 5C charging on the newest packs adds most of a full charge in about 12 minutes on XPENG's own S5 chargers. Vehicles are built in Zhaoqing, Guangzhou and Wuhan, with Magna Steyr in Graz, Austria, assembling G6 and G9 for Europe since 2025.

Volkswagen bought about 5% of XPENG in 2024 and co-developed the China Electrical Architecture (CEA) with it; VW models built in China on CEA start in 2026, and VW has agreed to use Turing chips there. That makes XPENG one of two architecture suppliers to Volkswagen, alongside Rivian in the West. Range-extended Kunpeng models are outside this page. See Compute Platforms and the ADAS compute architecture page.

Lineup

XPENG platforms and layers

Model lists are brief.

XPENG platform layers
Platform or layerLaunchedRoleModels
SEPA 2.0 (Fuyao)2023Modular body; cell-integrated body; castingsG6, G7, P7 (second generation), P7+, X9, MONA M03
Edward2020Earlier vehicle platformP7 (first generation), P5
X-EEA 3.02022Central computer plus zonal controllers; whole-car OTAG9, then SEPA 2.0 models
800 V SiC2022Full-domain high voltage; 5C charging on newer packsG9, G6, X9, G7, P7
Turing chip2025In-house AI chip for driving and cabinG7 Ultra, P7 Ultra

Partners

Who uses XPENG architecture

XPENG architecture partners
PartnerWhat it usesStatus
Volkswagen Group ChinaChina Electrical Architecture (CEA), co-developed; Turing chipsVW China models from 2026
Magna SteyrContract assembly of SEPA-era models for EuropeGraz, since 2025
DiDiFormer DiDi car program, now XPENG MONAMONA M03 since 2024

Sources

Sources and scope

Scope
XPENG EV Platforms
Sources
XPENG investor materials and launch events (2023-2025); Volkswagen Group China announcements; press reports
Updated
October 2026